Notark A series resins are specialized additive resins developed to improve peel strength and adhesion
performance in PCB and IC substrate applications. Notark A series resins provide critical reinforcement
to copper-clad materials and various inorganic fillers, ensuring superior reliability.
Strengthens copper foil adhesion for improved durability.
Ensures uniform physical properties across the entire insulation composite of resin matrix and inorganic fillers.
Works efficiently with standard PCB and IC packaging manufacturing.
Optimized for High-End Substrates – Perfect for buildup films and ultra-low loss dielectric applications.
Provides excellent mechanical strength.
Works seamlessly with high-end CCL materials like NER, NEZ, Q-cloth, silica filler, and beyond. Halogen- and oxygen-free to meet any regulatory requirements.
Notark A2000 enhances peel strength when blended with Notark R2000, across various copper foils. Similar benefits are observed in PPE resin systems.
| Cu Foil | Ra (µm) | Rz (µm) | Relative Peel Strength – Notark R2000 only | Relative Peel Strength – Notark A2000 @ 5 wt% loading |
|---|---|---|---|---|
| A | 0.83 | 7.15 | 100 | 150 ± 5 |
| B | 0.26 | 3.99 | 100 | 160 ± 5 |
| C | 0.30 | 3.96 | 100 | 205 ± 10 |
| D | 0.15 | 2.06 | 100 | 142 ± 5 |
* Lamination conditions: Curing temperature = 220°C, Pressure = 10 MPa, Curing time = 60 min; Peel Strength was measured as per IPC TM-650 2.4.9 (½” wide, 90° angle at 2 inch/min).
| Analysis Parameter | Unit | Typical Value |
|---|---|---|
| Total Solids | % | 20 – 40 |
| Viscosity, Brookfield @ 25 °C (18 SS) | cPs | 500 – 5 000 |
| Grit (Retained on 2485 mesh / 5 µm) | ppm | < 30 |
| Moisture (Coulometric KF) | ppm | < 20 |
| Color Appearance (Hunter Gardner) | – | < 0.3 |
| Metal ion residuals (ICP-OES)* | ppm | < 1 ppm |
| Appearance of toluene solution | – | Clear |
*No detectable metal elements. Less than 15 ppm P and 50 ppm Si.
